Disky

Faxy, kopírky, skenery a skartovačky

Grafické, zvukové a TV karty, reproduktory k PC

Herné konzoly

Kamery, fotoaparáty a ďalekohľady

Klávesnice, myšky, tablety a joystiky

Mediá, batérie, káble a redukcie

Monitory, projektory a plátna

Multifunkčné zariadenia

Navigačné systémy

Networking

Notebooky a príslušenstvo

Optické mechaniky

Pamäte

Počítačové skrinky a zdroje

Počítačové zostavy

Príslušenstvo k serverom

Procesory a chladiče

Software a hry

Spotrebná elektronika

Spotrebný materiál, rozšírenie záruky k tlačiarňam a MFP

Telefóny

Tlačiarne

USB kľúče, flash pamäte a čítačky kariet

Webkamery, slúchadlá a mikrofóny

Základné dosky

Záložné zdroje

CASE TLA570, USB2,4x5.25,2x3.5 Silver/B

Specificat ionMB Capable: ATX or mATXDimens ions(W/H/D ): 200*430*45 0mmDrive bays: 4*5.25 external2* 3.5 external4* 3.5 internalFr ont ports: 4*USB1*Mic ,1*Headpho neFans: Rear 120mm fanAir duct: 80

MB FOX, H67, 1155, 2xDDR3, GLan, VGA, SA

Processor: Intel Sandybridg e processors Chipset: Intel H61 Chipset Front Side Bus: Memory: Dual channel DDR3 1333/1066 x 2 DIMMs, Max. 8GB VGA on Die: Expansion Slots: 1* PCIe2.0 x16 IDE: N/

MB FoX A55MX, FM1, 4xDDR3, VGA+PCIe, GbL

Processor: AMD FM1 socket CPU , Quad-Core CPU; Up to 4 "Husky" CPU Cores Chipset: AMD A55 Chipset (Hudson D2) Front Side Bus: Memory: Dual channel DDR3 1866/1600/ 1333 x 2 DIMMs, Max. 32GB VG

CASE TH-001, 400W, USB2,4x5.25,2x3.5 Si

Specificat ionMB Capable: ATX or mATXDimens ions(W/H/D ): 200*430*45 0mmDrive bays: 4*5.25 external2* 3.5 external4* 3.5 internalFr ont ports: 4*USB1*Mic ,1*Headpho neFans: Rear 120mm fanAir duct: 80

MB FOX, Intel® NM10, 2xDDR2, GLan, VGA,

rocessor: Intel AtomTM Singal-cor e D425 processor mounted onboard Chipset: Intel NM10 Front Side Bus: Memory: DDR2 800/667 MHz x 2 DIMM, Max. 4GB VGA on Die: Integrated Intel GMA 3150 Expans

CASE TH-003, 400W, USB2,4x5.25,2x3.5 Si

Specificat ionMB Capable: ATX or mATXDimens ions(W/H/D ): 200*430*45 0mmDrive bays: 4*5.25 external2* 3.5 external4* 3.5 internalFr ont ports: 4*USB1*Mic ,1*Headpho neFans: Rear 120mm fanAir duct: 80

Case Foxconn G-007, 3x5.25, 1x3.5ext, 4x

Specificat ion MB Capable: ATX or mATX Dimensions (W/H/D): 210*450*48 0mm Drive bays: 3*5.25 external 1*3.5 cardreader 4*3.5 internal Front ports: 4*USB 1*Mic,1*He adphone e-SATA Port Fans: Rear

MB FOX, So1156, H55, 4xDDR3, VGA, PCIe,

Processor: Intel Core™ i7,Core™ i5,Core™ i3 processors , Socket LGA1156 Chipset: Intel H55Front Side Bus: Memory: Dual channel DDR3 2000(oc)/1 600/1333/1 066 x 4 DIMMs, Max. 16GBVGA on Die: Int

MB FoX AMD FM1, 4xDDR3, VGA+PCIe, GbLAN,

Processor: AMD FM1 socket CPU , Quad-Core CPU; Up to 4 "Husky" CPU Cores Chipset: AMD Hudson D3 co-lay D2 Chipset (default D3) Front Side Bus: Memory: Dual channel DDR3 1866/1600/ 1333 x 4 DI

MB FOX, H67, 1155, 4xDDR3, GLan, VGA, SA

rocessor: Intel Sandybridg e processors , Socket LGA1155 Chipset: Intel H67 Front Side Bus: Memory: Dual channel DDR3 1333/1066 x 2 DIMMs, Max. 16GB VGA on Die: Integrated Intel GMA HD graphic

MB FoX A75A, FM1, 4xDDR3, VGA+PCIe, GbLA

Socket FM1 CPU (Max Support) AMD Llano APU AM3 CPU Ready N/A FSB/BCLK/H yper Transport Bus N/A Chipset AMD A75 DDR3 Memory DDR3 1066/1333/ 1600/1866 DDR2 Memory N/A Memory Channel Dual DIMM Sl

MB FoX AHD1S-K, AMD E-350, 2xDDR3, VGA+P

Processor: AMD E-350 Processor Chipset: AMD Hudson D1 Front Side Bus: Memory: Single channel DDR3 1066 x 2 DIMMs, Max 8GB VGA on Die: Expansion Slots: 1* PCIe 2.0 x 16 slot IDE: Serial ATA(S